Terbium Sputtering Target (Tb)

Terbium Sputtering Target (Tb)
Material Type:
Formula:
Mol:


Boiling Point (°C):
Density:
Atomic number :
Terbium Sputtering Target (Tb)
Tb
1356°C


3230°C
8.253g/cm³
65
Description

Material Type

Terbium

Symbol

Tb

Atomic Weight

158.93

Atomic Number

65

Color/Appearance

Silvery White, Metallic

Melting point(°C)

1356°C

Boiling point(°C)

3230°C

Density[kg/m3]

8.253g/cm³

Molar volume

19.30 × 10-6 m3/mol

Rare earth terbium targets are made using the element terbium (Tb). Terbium is a rare earth metal with unique physical and chemical properties, widely used in various high-tech fields. Here are some primary applications of rare earth terbium targets:

Magnetic Materials: Terbium targets can be used to produce various magnetic alloys and thin films, which are important in magnetic storage devices and magnetic sensors. Terbium, with its high magnetic moment, is a key component of many high-performance magnetic materials.

Luminescent Materials: In light-emitting diodes (LEDs) and fluorescent lamps, terbium can be used as a dopant to improve the luminescent effect, especially in the green and blue light fields. Terbium's unique electronic structure makes it particularly important in optoelectronic applications.

Superconducting Materials: Terbium is also being explored for use in certain types of superconducting materials, which are used in research and industrial applications such as medical imaging devices and particle accelerators.

Research and Development: In materials science and physics research, terbium targets are used to synthesize new materials and study their properties, especially in the application of magnetic and optoelectronic properties.

Fiber Optic Communication: In fiber optic communication technology, terbium can be used to manufacture specific optical fiber amplifiers, which can enhance signals, improve transmission distance, and quality.
LXAM produces terbium with a regular purity of REM99.9% and distilled terbium with a purity of REM99.99%. The average grain size is <200um.

Manufacture Method: Hot Pressing (HP), Hot/Cold Isostatic Pressing (HIP, CIP), Vacuum Melting, Vacuum Sintering


Features:

High purity, high density (Close to 100%), low gas content

Grain refinement

Semiconductor grade

High utilization efficiency


Production Process:

Raw Material Preparation - Melting - Forging - Rolling - Heat Treatment - Machining - Quality Inspection - Packaging - Shipping


Customized Size

Circular: Diameter <= 14 inch, Thickness >= 1mm;

Rectangle: Length <= 48 inch, Width <= 15.75 inch, Thickness >= 1mm.

For larger product sizes, we can do 45-degree or 90-degree angle tiles.

If you have other requirements, we can customize for you. Please provide drawings (PDF, JPG, PNG).

LXAM offers high-quality products at competitive prices and welcomes inquiries, promising a response within 24 hours.

 

 

 


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