Boride Sputtering Target

Boride Sputtering Target
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Boride Sputtering Target


Description

Rare earth boride sputtering targets are compound materials composed of rare earth elements and boron, typically used for thin film deposition in physical vapor deposition (PVD) processes. Rare earth borides exhibit excellent mechanical, thermal, and electrical properties. They have a small work function, high hardness, high melting point, and high conductivity. Additionally, they possess high Young's modulus, good thermal stability, and chemical stability. They can meet the requirements of field emission performance, such as low turn-on electric field and threshold electric field. They also have a large field emission enhancement factor and stable emission current.

Typical Applications:

Optical Device Manufacturing: Rare earth boride targets can be used to prepare optical thin films such as reflection mirrors, filter films, etc., for the manufacturing and optimization of optical devices.

Electronic Device Fabrication: In the process of electronic device fabrication, rare earth boride targets can be used to deposit conductive thin films or other functional thin films for the manufacturing of semiconductor devices, integrated circuits, etc.

Magnetic Material Research: Some rare earth borides exhibit magnetism and can be used to prepare magnetic thin films and magnetic storage devices, applied in magnetic recording, sensors, etc.

Functional Material Research: Rare earth boride targets can also be used to investigate their special physical and chemical properties, exploring the synthesis and application of new functional materials.

Below are some of the boride targets we commonly provide. Feel free to contact us via phone or online consultation if you have any requirements.

CeB6

GdB6

LaCeB6

LaB6

NdFeB

NdB6

SmB6

TbB6

Manufacture MethodHot Pressing (HP), Hot/Cold Isostatic Pressing (HIP, CIP), Vacuum Melting, Vacuum Sintering

Features:

• High purity, high density (Close to 100%), low gas content

• Grain refinement

• Semiconductor grade

• High utilization efficiency

Production Process:

Raw Material Preparation - Melting - Forging - Rolling - Heat Treatment - Machining - Quality Inspection - Packaging - Shipping

Customized Size

Circular: Diameter <= 14 inch, Thickness >= 1mm;

Rectangle: Length <= 48 inch, Width <= 15.75 inch, Thickness >= 1mm.

For larger product sizes, we can do 45-degree or 90-degree angle tiles.

If you have other requirements, we can customize for you. Please provide drawings (PDF, JPG, PNG).

LXAM offers high-quality products at competitive prices and welcomes inquiries, promising a response within 24 hours.

 

 



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