Yttrium alloy sputtering targets are composed of yttrium elements and other metal elements, such as zirconium-yttrium, magnesium-yttrium, nickel-yttrium, and tin-yttrium alloy sputtering targets. The characteristics of yttrium alloy sputtering targets include high purity, excellent thermal stability, specific optical and electrical properties, good chemical stability, and compatibility with various materials.

Typical applications:
Manufacture high-temperature and corrosion-resistant materials: In the fields of optoelectronics, electronics, and other high-tech areas, the consistency and quality of their film deposition are guaranteed.

Yttrium alloy sputtering targets occupy a special position in film deposition and microelectronic manufacturing because of their high purity, stability, and specific physicochemical properties. These characteristics make yttrium alloy sputtering targets an ideal choice for preparing various thin film materials.

High purity. The purity of yttrium is usually up to 99.9% or 99.99%, which helps reduce impurity interference and ensure the consistency and quality of film deposition in optoelectronics, electronics, and other high-tech fields.Excellent thermal stability. Yttrium has a high melting point (approximately 1522°C), which can maintain stability at high temperatures and is not easily oxidized or undergo other chemical reactions. Specific optical and electrical properties. Thin films deposited using yttrium alloy sputtering targets exhibit excellent properties in optical and electrical applications, such as in certain optical coatings and microelectronic devices.

Good chemical stability. Yttrium and yttrium alloy sputtering targets exhibit excellent corrosion resistance to most chemical substances, showing long-term stability in challenging environments. Compatibility with other materials.

The chemical properties of yttrium enable it to form stable compounds or alloys with many other elements and compounds, providing a wide range of possibilities for various applications.

Manufacture Method: Hot Pressing (HP), Hot/Cold Isostatic Pressing (HIP, CIP), Vacuum Melting, Vacuum Sintering

Features:

• High purity, high density (Close to 100%), low gas content

• Grain refinement

• Semiconductor grade

• High utilization efficiency

Production Process:

Raw Material Preparation - Melting - Forging - Rolling - Heat Treatment - Machining - Quality Inspection - Packaging - Shipping

Customized Size

Circular: Diameter <= 14 inch, Thickness >= 1mm;

Rectangle: Length <= 48 inch, Width <= 15.75 inch, Thickness >= 1mm.

For larger product sizes, we can do 45-degree or 90-degree angle tiles.

If you have other requirements, we can customize for you. Please provide drawings (PDF, JPG, PNG).