Scandium Alloy Sputering Target

Scandium Alloy Sputering Target
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Scandium Alloy Sputering Target


Description

 Scandium alloy sputtering targets are composed of scandium elements and other metal elements, such as AlSc, FeSc, MgSc alloy sputtering targets. Scandium, as a transition metal element and a rare earth element, is added to alloys. Its advantages include grain refinement: the addition of scandium can significantly refine the grain of cast alloys, thereby improving the strength and toughness of the alloy. It also increases the recrystallization temperature of the scandium alloy, enhancing the material's thermal stability. Additionally, it improves processing performance: the weldability, heat resistance, corrosion resistance, and resistance to neutron irradiation damage of scandium alloys are all improved, making them have better application potential in extreme environments. Therefore, scandium alloys are considered as high-performance structural materials for the new generation of aerospace, aviation, shipbuilding, and weaponry.

 

Typical applications:
Aerospace and aviation: Scandium alloys are widely used in the aerospace and aviation fields as high-performance structural materials for manufacturing aircraft and rocket components.

Shipbuilding and weaponry: The high strength and corrosion resistance of scandium alloys make them important materials for manufacturing ships and weapons.

Electronics industry: Scandium is used in the electronics industry as a semiconductor device, such as the application of scandium sulfates in semiconductors, and the use of scandium-containing ferrites in computer magnetic cores.

Chemical industry: Scandium compounds are used as alcohol dehydrogenation and dehydration agents, as well as highly efficient catalysts in the chemical industry. Glass and electroluminescent source industry: Special glasses containing scandium and scandium-sodium lamps have advantages in terms of light color and efficiency.

Manufacture Method: Hot Pressing (HP), Hot/Cold Isostatic Pressing (HIP, CIP), Vacuum Melting, Vacuum Sintering


Features:

High purity, high density (Close to 100%), low gas content

Grain refinement

Semiconductor grade

High utilization efficiency


Production Process:

Raw Material Preparation - Melting - Forging - Rolling - Heat Treatment - Machining - Quality Inspection - Packaging - Shipping


Customized Size

Circular: Diameter <= 14 inch, Thickness >= 1mm;

Rectangle: Length <= 48 inch, Width <= 15.75 inch, Thickness >= 1mm.

For larger product sizes, we can do 45-degree or 90-degree angle tiles.

If you have other requirements, we can customize for you. Please provide drawings (PDF, JPG, PNG). 


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